There are three major trends guiding device designers as they develop the next generation of printed circuit boards (PCBs) – miniaturization, increased component density and the market’s need for continuous performance improvements.

High-performance PCBs typically require more components, which significantly complicates design, fabrication and assembly. EMI and diminished signal integrity also pose greater challenges as PCBs get smaller, faster and denser.

Using 3M™ Embedded Capacitance Material helps lower voltage ripple and dampens board resonance, leading to reduced impedance and EMI. It also reduces the number of decoupling connectors needed, helping eliminate space constraints on miniaturized devices. This means you can offer PCBs with dramatically improved performance without complicating your process.